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  • 2020/03 16

    3D chip

    Moore's Law has encountered development bottlenecks, but the market's requirements for chip performance have not decreased. In this case, the chip also began to explore in many directions to find better ways to improve performance. According to the results released by related semiconductor companies in recent years, we have found that chips are moving from two-dimensional to three-dimensional world-chip design, chip packaging and other links are moving closer to 3D structure.

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  • 2020/03 09

    Qualcomm's 5G macro

    In the past few decades, the mobile communication industry has brought dramatic changes to people's lives. After the rapid development of 3G and 4G, manufacturers and consumers worldwide are looking forward to the arrival of 5G. As the first year of 5G in 2019, 5G services have been launched in many countries and regions around the world, and many leading OEMs are also struggling to seize market opportunities and launch 5G mobile phones. 2020 will be the year of 5G expansion. 5G services and 5G terminals will serve more and more global users, ...

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  • 2020/03 02

    SOI wafers usher in a new air vent

    SOI (silicon-on-insulator) wafers have high performance and low power consumption. Compared with traditional silicon wafers, they have advantages in high-frequency and high-power environments. Recently, they have benefited from applications such as 5G and AI edge computing. The demand for its components has continued to expand, and the unit price and gross profit of SOI wafers are several times that of traditional silicon wafers. The profit performance can be expected. Stand firm in the 5G generation and grab business opportunities.

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  • 2020/02 24

    Power semiconductor will start a new era

    Infineon released its FY1Q20 financial report (the fourth quarter of 2019) on February 5, US time. According to its official data, Infineon achieved revenue of 1.916 billion euros in the current quarter, a decrease of 3% year-on-year. In addition, at its financial report meeting, Infineon also revealed a message-they had originally planned to temporarily close the Dresden, Germany, and the Kurin factories in Malaysia for two weeks, but because Changes in the market in recent times have led Infineon to abandon this plan.

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  • 2020/02 17

    How should the heat dissipation, EMI, and packaging of a DC / DC converter be balanced?

    In today's highly competitive era, the challenge for product designers is not only to keep pace with their peers, but also to stay ahead of the pack. This places higher demands on system designers who want to innovate with differentiated products.

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  • 2020/02 14

    Huada Semiconductor has provided more than 4 million power management chips

    At present, the new crown epidemic is fighting, and the thermometer is undoubtedly one of the important weapons in this battle, but the reality is that the thermometer has become urgent all over the country and has become one of the shortest funds.

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